Explore our core product line featuring high-density PCBs, customized SMT PCBA assemblies, and enterprise-grade DRAM memory solutions.
Macrotrends shaping high-density circuit routing, signal integrity parameters, and scalable global OEM electronics supply chains.
The demand for High-Density Interconnect (HDI) PCBs is surging as modern devices scale down in footprint. Achieving low-loss dielectric constants (Dk) and low dissipation factors (Df) is crucial for signal propagation above 28 GHz. Our production runs use premium substrates like KB6160 FR4 to prevent trace attenuation, ensuring reliable signal integrity for complex multilayer stack-ups.
With memory buses hitting speeds up to 5600MHz and beyond, hardware design requires precise integration between the motherboard logic and DRAM modules. Clean impedance matches, balanced trace geometry, and strict cross-talk mitigation on modern double-sided PCBs are essential for noise reduction and seamless power distribution network (PDN) management.
Global environmental regulations (RoHS, REACH) mandate lead-free materials, making Hot Air Solder Leveling (HASL) and lead-free resin processes the standard for electronic components. Our manufacturing lines implement advanced eco-friendly surface finishes (HASL Lead-Free, Immersion Gold, Immersion Silver) to guarantee mechanical durability and compliant joint connections.
Celtrix Memory Technologies Co., Ltd. is a dedicated, high-performance DRAM memory and advanced PCB/PCBA manufacturer. Since 2017, we have integrated state-of-the-art automated production, precise surface-mount technology (SMT), and high-speed memory encapsulation to serve consumer, industrial, enterprise, and embedded applications worldwide.
Operating a modern, ISO 9001-certified factory spanning 28,600 m², our facilities deliver complex electronics hardware from raw multilayer board fabrication to high-frequency double-sided printing and system-level functional testing.
How our ISO 9001:2015 certified workflow ensures high yields, zero electrical defects, and reliable memory-to-board performance.
Incoming Quality Control (IQC) tests raw laminates, copper foils, memory chip wafers, and passive SMD components to confirm compliance with JEDEC specifications before assembly.
Automated Optical Inspection (AOI) detects component misalignment, cold solder joints, and solder bridging. In-house X-Ray machinery analyzes internal solder ball connections on BGA packaged components.
Finished components, including high-speed DDR4/DDR5 modules and industrial PCBA power supplies, undergo dynamic stress testing at elevated temperatures to filter out early failure risks.
Memory products undergo compatibility profiling on key server, desktop, and embedded computing systems, verifying SPD parameters across leading CPU chipsets and motherboards.
Bridging electronic system fabrication and custom manufacturing for critical industry use cases.
Modern industrial environments require power-supply instrumentation boards that can withstand high voltage surges and extreme vibration. Our SMT & DIP plug-in soldering assembly operations use immersion silver surface treatments, delivering excellent electrical connectivity, chemical corrosion resistance, and high mechanical reliability for heavy machinery controllers.
Enterprise infrastructure relies on high-density DDR5 RAM (ranging up to 5600MHz) and server motherboards with low-latency capabilities. We provide custom SPD programming, capacity adaptation (from 4GB up to 32GB modules), and custom heatsink integrations. These ensure efficient heat dissipation under continuous compute loads in cloud servers and database nodes.
We offer tailored hardware options for distributors and system integrators. Our OEM and ODM services include customized silkscreen printing, bespoke packaging layouts, private label manufacturing, and capacity adjustments. In the last year alone, our design teams successfully released 168 new client configurations, optimizing time-to-market.
Navigating logistics, lead-free regulations, and international electronics certifications can be complex. Celtrix provides clear supply chain management and reliable technical support to help businesses streamline their procurement process.
Exporting to over 50 countries, including North America, Europe, Southeast Asia, South America, the Middle East, and Oceania. We coordinate customs declarations and shipping routes for reliable delivery.
Our lead-free production lines use HASL, ENIG, and Immersion Silver technologies, meeting environmental regulations such as WEEE, REACH, and RoHS.
From prototyping and low-volume initial runs to scale production, our automated machinery adapts quickly to minimize tooling lead times.
Our commitment to research and development and precision engineering prepares us for next-generation hardware needs.
Improving SMT placement precision to integrate dense micro-BGAs and smaller footprint passives (01005 packages) for wearable medical and aerospace applications.
Developing memory solutions with advanced on-die ECC architectures that target bandwidth speeds above 6400MT/s to support real-time data processing workloads.
Integrating active and passive components inside internal PCB layers to optimize circuit layouts, reduce EMI, and improve thermal performance.
Using machine learning within our optical inspection systems to predict potential solder defects and track equipment performance metrics.
Technical answers regarding PCB material stackups, SMT tolerances, and memory module validation.
Inside Celtrix's 28,600 m² cleanroom manufacturing facility and automated assembly warehouse.
Complete project supplies including double-sided printers, DDR4 upgrades, and custom OEM computer motherboards.
Celtrix Memory
