Explore our leading-edge memory modules, motherboards, and advanced thermal management components.
A global standard in premium DRAM architectures and high-density computing components.
Established in 2017, Celtrix Memory Technologies Co., Ltd. operates a state-of-the-art 28,600 m² manufacturing facility. Dedicated to the advanced R&D, precision manufacturing, and strategic customization of premium memory solutions, we serve the enterprise, industrial, and high-performance computing markets globally. Incorporating ISO 9001 criteria, automated optical inspection, and intense multi-tier reliability screening, our products are engineered for the zero-fault requirements of modern high-power environments.
Understanding thermal interfaces, high-power electronics demand, and supply chain allocation.
Modern high-performance compute cards, power converters, and high-frequency LED systems demand superior heat dissipation. Aluminum circuit boards (Metal Core PCBs) offer thermal conductivity values from 1.0 W/m-K up to 9.0 W/m-K, ensuring minimal thermal resistance and long-term component durability.
Enterprise procurement groups prioritize manufacturing scale and design flexibility. Standardized layouts must integrate flawlessly with custom copper-aluminum composites and high-frequency dielectric materials (e.g., Taconic, Arlon) to support automotive ADAS, cellular base stations, and high-output power supplies.
From RoHS lead-free processes like HASL to ISO 9001 standards, compliance ensures consistent performance. Every layer configuration undergo strict Automated Optical Inspection (AOI), functional burn-in tests, and thermal stress tests to prevent delamination under harsh operating criteria.
How advanced dielectric coatings and material composites define the next generation of power boards.
Selection of premium aluminum alloys (e.g., 5052, 6061) paired with custom high-frequency substrates like Taconic TLY-5 to guarantee mechanical strength and low dielectric loss.
Applying highly conductive ceramic-filled polymer layers to enable rapid heat transfer from critical active components directly to the structural aluminum backing.
Executing double-sided and multilayer circuit processing with resin-plugged vias, providing seamless electrical insulation and optimum signal integrity.
Deploying Lead-Free HASL, ENIG, or OSP methods to enhance solderability, protect copper circuits from oxidation, and ensure compatibility with high-speed SMT assembly.
Take a virtual tour through our modern assembly, testing, and shipping facilities.
Critical technical and business issues resolved by our integration experts.
Aluminum substrate PCBs generally feature thermal conductivities ranging from 1.0 W/m-K up to 9.0 W/m-K. The exact performance relies on the thickness and composition of the dielectric layer separating the copper circuit from the aluminum core.
Our R&D engineering team conducts rigorous system-level testing, including signal integrity analysis, thermal modeling, and multi-platform compatibility runs across server architectures to guarantee absolute interoperability and long-term stability.
We offer comprehensive personalization, including custom heat spreader colors, structural layouts, SPD programming, custom packaging designs, logo printing, and material stack-ups (including copper-aluminum composite motherboards).
Backed by 7 years of specialized export experience across more than 50 countries, we maintain direct partnerships with leading shipping lines, offering compliant customs document handling, and secure packaging to ensure rapid global transit.
High-speed DDR4/DDR5 memories, specialized PCBs, and enterprise-grade heat sinks.
Celtrix Memory
